Stratix 10MX – High memory bandwidth on SiP package

  The Stratix® 10 MX DRAM system-in-package (SiP) family combines a 1 GHz high-performance monolithic FPGA fabric, state-of-the-art Intel Embedded Multi-die Interconnect Bridge (EMIB) technology, and High Bandwidth Memory 2 (HBM2), all in a single package (SiP). The blue DRAM boxes (A), show the HBM2 memory tiles that the device integrates in package (up to … Continue reading Stratix 10MX – High memory bandwidth on SiP package

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